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Book Description Free Ebook Download
+This book describes the specific packaging and interconnect challenges involved in developing implantable microelectronic and MEMS devices for the brain and will explain a variety of the currently successful approaches. Significant, open problems will also be described, such as development of advanced materials, testing methodologies, and sensing and actuation technologies.
Product Details - Hardcover: 200 pages
- Publisher: Springer-Verlag New York Inc. (September 27, 2012)
- Language: English
- ISBN-10: 1441985190
- ISBN-13: 978-1441985194
- Shipping Information: View shipping rates and policies
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