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Book Description    Free Ebook Download
  +This book describes the specific packaging and interconnect challenges involved in developing implantable microelectronic and MEMS devices for the brain and will explain a variety of the currently successful approaches. Significant, open problems will also be described, such as development of advanced materials, testing methodologies, and sensing and actuation technologies.   
       Product Details                      - Hardcover: 200 pages
         - Publisher: Springer-Verlag New York Inc. (September 27, 2012)
        - Language: English
        - ISBN-10: 1441985190
  - ISBN-13: 978-1441985194
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